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CEA-Leti, a CEA microelectronics research institute, will introduce a smart, integrated multi-sensor system for knee implants at CES 2022 that can help surgeons more accurately position the implant, dramatically reduce risk of follow-up surgery, and enhance rehabilitation.
CEA-Leti has reported the world’s-first demonstration of 16-kbit ferroelectric random-access memory (FeRAM) arrays at the 130nm node that advances this energy-saving technology closer to commercialization. The breakthrough includes back-end-of-line (BEOL) integration of TiN/HfO2:Si/TiN ferroelectric capacitors as small as 0.16 µm², and solder reflow compatibility for the first time for this type of memory.
CEA-Leti has developed an innovative secure integrated circuit packaging technology that protects against eavesdropping and electromagnetic interference attacks.
This digital sniffer can recognize thousands of smells from the most delicate (flowers, perfumes, fruits and monitoring their ripening) to the less pleasant (putrefaction, ammonia, etc.).
With CEA-Leti’s support, LMGP, Institut Néel, and applied economics lab GAEL have been investigating the rare and critical elements (gallium, indium, yttrium, and cerium) in white LEDs.
‘Radically Different’ Concept Enables ‘Dual-Behavior’ DevicesThat Can Store Data and Energy
CEA-Leti scientists, in collaboration with researchers at Politecnico di Milano (POLIMI), have developed the world’s smallest-footprint MEMS gyroscope that is capable of providing navigation-grade performance. The researchers were able to meet these specifications with a sensor footprint of only 1.3 mm2 by leveraging nano-resistive sensing.
In research for the European Union H2020 Pixapp project, CEA-Leti scientists have developed a sub-micron-precision passive automated microlens alignment process.
CEA-Leti, a CEA technology research institute, received the award in the Impact Delivered category for the development of a patented Smart Cut™ process of substrate fabrication in collaboration with SOITEC, which results in a transfer of a thin active layer of silicon from one substrate to another, which can be used in all electronic devices.
In a world first, a CEA-Leti team has produced a magnetoencephalography (MEG) prototype operating at room temperature that can produce brain images comparable with those generated by current equipment running at temperatures close to absolute zero. This quantum technology could expand access to MEG systems, help create highly miniaturized MEG systems and diversify their use. A start-up, MAG4Health, has recently been launched.
Piezoelectric Micromachined Ultrasonic Transducers, or PMUTs, are a type of MEMS. The devices are currently plagued by an angular resolution in excess of 90° in some cases. CEA-Leti brought the figure down to 18° for the detection of an object placed 40 cm away from the device.
Together, GTP Nano and the CEA have set the ambitious goal of covering the entire nanodrug value chain from lab to manufacturing plant to offer pharmaceutical companies full process development, GMP batch production, and aseptic fill and finish services.
The future of telecom relies more than ever on the semiconductor industry. While previous generations relied on the continuity of pre-existing technologies to achieve absolute performance, 6G, as viewed by CEA-Leti, aims to adopt a new approach, combining energy frugality with performance.
In the future, vehicles will be able to tell how their drivers are feeling, both physically and mentally, and take appropriate measures to ensure optimal safety.
Rapid advances in resistive oxide memory (OxRAM) could soon put the technology on manufacturers' production lines.
Silicon photonics—integrated optical circuits on silicon substrates—first emerged around 20 years ago. Since then, the now-crucial technology has gained traction on growing demand for very-high-speed fiber optic communications. Scientists at CEA-Leti are pushing silicon photonics to new limits to bring data centers and supercomputers the terabit/s capabilities they need.
CEA-Leti has developed a new spectrometric imaging detector that can clearly distinguish breast tumor tissue from healthy tissue in mice at a glance.
Tiempo Secure, a secure semiconductor design company, has been selected, in a partnership with the CEA, as a winner of the Great Cybersecurity Challenge ("Grand Défi Cyber"), a project launched by the French government in 2020. The announced objective of the Great Cybersecurity Challenge is to make our systems sustainably resilient to cyberattacks. Participating in the Challenge brings a valuable support to Tiempo Secure for the development of the iMRC project, which makes IoT connected objects resistant to known and yet unknown attacks.
In research for the European Space Agency’s Artes+ MONAMI project, Kinéis and CEA-Leti are developing the next generation of miniature hybrid terrestrial/satellite antennas for IoT sensors.
CEA-Leti unveils its 2020 Silicon Components Division report highlighting the latest advances for silicon devices and technologies.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.