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Liste de actualités du Leti
NEW-6G Initiative Will ‘Rethink’ Nanotech, Draw Roadmaps, Encourage Cooperation
And Foster the Emergence of Innovative Ideas for Future 6G Technologies
GRENOBLE, France – Feb. 22, 2021 – CEA-Leti and Dolphin Design have developed an adaptive back-biasing (ABB) architecture for FD-SOI chips that can be seamlessly integrated in the digital design flow with industrial-grade qualification, overcoming integration drawbacks of existing ABB techniques.
FLUOPTICS©, a spinoff of CEA-Leti, a CEA Tech institute, is reporting continued growth despite the tough economy. The company’s fluorescence imaging solution is literally revolutionizing surgery.
Limoges, 11 February 2021 - Legrand, global specialist in electrical and digital building infrastructures, announces the launch of a new generation wireless and batteryless switch. This technological innovation was developed in collaboration with CEA, a major player in research, development and innovation.
GRENOBLE, France – Feb. 4, 2021 – A team of French scientists has started to build a prototype interposer that meets requirements of quantum computing by allowing integration and testing of both quantum and control chips fabricated from different materials and technologies and coming from different partners.
GRENOBLE, France – Feb 9th, 2021 – CEA-Leti today announced a visionary EU 6G research project for next-generation wireless connectivity. Called RISE-6G, it will design, prototype and test smart and energy-sustainable technological advances based on reconfigurable intelligent surfaces (RIS) that will enable programmable control and shaping of the wireless propagation environment.
GRENOBLE, France – Feb.4, 2020 – CEA announced today the acquisition of a Cryogenic Wafer Prober manufactured by Bluefors Oy, the Finnish specialist in designing and manufacturing ultralow temperature-dilution refrigerator systems for cutting-edge research in quantum computing and nanotechnology. CEA-Leti, a technology research institute at CEA, is the first microelectronics research institute to install this strategic equipment in its cleanroom.
GRENOBLE, France – Feb. 4th, 2021 – A European consortium was launched today with the goal of scaling silicon quantum technologies. Named QLSI (Quantum Large-Scale Integration with Silicon), this four-year EU project, coordinated by CEA-Leti, will lay the foundation for the EU's industrial-scale implementation of semiconductor quantum processors and position Europe as a global leader in quantum computing. The project will focus on demonstrating that spin qubits are the leading platform for scaling to very large numbers of quantum bits, or qubits, the building blocks of quantum information processing.
GRENOBLE, France – Feb. 4, 2021 – CEA-Leti scientists have opened a pathway to large-scale integration of Si-spin qubits using existing flip-chip processes with die-to-wafer 3D-interconnect technologies developed in-house.
CEA-Leti scientists, working with researchers at Politecnico di Milano, have developed the world's first high-performance gyroscope for operating in severe environments, such as industrial and aeronautic equipment and automobiles. The breakthrough proves it is possible to detect minute rotational movement even among system vibrations.
Article in Nature Electronics Details Method that Takes Advantage of RRAM Non-Idealities
To Create Intelligent Systems that Have Potential Medical-Diagnostic Applications
Energy-efficient, high-yield displays that deliver stellar image quality are now within reach!
Could all-natural materials be used to make antimicrobial dressings for open, infected wounds? A PhD research project conducted at CEA-Leti, CERMAV, and LGP2 investigated precisely this kind of environmentally-friendly dressing for inpatient care scenarios, and the findings were encouraging.
In an avalanche, every minute counts. The longer a victim is buried under the snow, the less chance they have of surviving. CEA-Leti researchers equipped a drone with a network of antennas run by a radio-frequency circuit to help speed up search and rescue operations.
From January 11 to 14, 2021, the CEA will participate in the Consumer Electronic Show (CES) for the 7th consecutive year. For this 100% digital version, the CEA is supporting 3 startups spun off from its laboratories that have developed technological solutions in response to three major societal challenges: the energy transition, the digital transition and the medicine of the future.
In a world first, CEA-Leti, a CEA Tech institute, implemented a mechanical storage technology for power converters, boosting both power density and energy efficiency while enabling new, more compact form factors. This advance could address 80% of power converter use cases.
Papers at IEDM 2020 Explore Ways to Leverage 3D Technology's Strengths For Lowering Device Energy Consumption and Energy Lost in Data Transmission. CEA-Leti presented two papers this week at IEDM 2020 that confirm the advantages of combining 3D architectures and resistive-random-access-memories (RRAM) for in-memory computing (IMC), and their applications for Edge-AI and neural networks. The projects were designed to look at different ways to leverage 3D's strengths in lowering device energy consumption as well as energy lost during data transfer.
Founded in 1992 by four CEA researchers who wanted to exploit Smart Cut™ technology to produce silicon on insulator (SOI) wafers on an industrial scale, Soitec is one of the first startups to arise from CEA-Leti.
Aledia, a French startup pioneering a disruptive technology for microLED displays, today announced it has manufactured the world's first microLED chips produced on 300mm (12") silicon wafers. The company, which developed its breakthrough technology on 200mm (8") silicon wafers over the past eight years, will produce the chips on both 200mm and 300mm wafers.
Gallium Nitride Seen as Highly Efficient Replacement for Silicon in Wide Range of Consumer and Industrial Uses. Two complementary research papers from CEA-Leti confirmed that the institute's approach to gallium-nitride (GaN) technologies is on track overcome challenges in the architecture and performance of advanced GaN devices embedding a MOS gate, and targeting the fast-growing global market for power-conversion systems.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.