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Liste de actualités du Leti
The photonixFAB project aims to empower photonics innovation by SMEs and large entities by providing low barrier access to both low-loss silicon nitride (SiN) and silicon-on-insulator (SOI) based photonics platforms with indium phosphide (InP) and lithium niobate (LNO) heterogenous integration capabilities.
Advanced 3D packaging is a complex technology that is expected to become increasingly important in packaging a wide range of electronic devices in various fields such as IoT, AI, or medical fields. Finding viable solutions to meet the growing global demand for new integration developments has therefore become relevant.
As the number of IoT connections continues to expand, new data communication link solutions will be needed to cope with the data deluge and enable a more sustainable digital (r)evolution.
The surge in nanoelectronics and photonics has resulted from a need for miniaturized tools and devices that are an integral part of our lives. Additionally, it has now become necessary to consider innovation through issues involving planetary resources and energy consumption. Because it is installed in miniaturized devices, silicon-based CMOS technology is now central to these issues. This presents significant challenges for reaching a low energy consumption that aligns with current societal preoccupations.
MEMS and NEMS—micro- and nanoelectromechanical systems—are tiny devices like sensors, actuators, and micromirror arrays, with moving parts that are sensitive to a physical quantity like speed, pressure, or direction. They convert this physical quantity into an electrical signal, which can, in some cases, operate an integrated micro-actuator.
As embedded AI algorithms become more sophisticated, they also become more data intensive. In-memory computing dramatically reduces the power consumption associated with data transfer between memory and logic while helping keep data more secure. New non-volatile memory technologies that imitate the human brain’s energy-efficient synapses are also driving new low-power solutions. CEA develops and integrates all these technologies for a range of IoT projects.
As the limits of Moore’s Law approach, advanced chip packaging has emerged as a solution for continued scaling. CEA offers a complete chiplet and 3D integration toolkit enabling a modular “one to many” approach that speeds up the development of new solutions for automotive, high-performance computing,data centers, imaging, and more.
By launching the NextGen project, CEA aims to develop new generations of FD-SOI chips with better energy efficiency. It will ensure the capacity to engineer the most advanced components and maintain French and European microelectronics competitive for the future markets.
Vitesco Technologies, a leading international provider of modern powertrain technologies and electric mobility solutions, presents the first outcome of its partnership with the CEA in France: Together they have developed a “switched battery” (SWIBA) management technology that further improves the overall performance of the powertrain of electric vehicles.
CEA-Leti and Intel announced a joint research project to develop layer transfer technology of two-dimensional transition-metal dichalcogenides (2D TMDs) on 300mm wafers with the goal to extend Moore’s Law beyond 2030.
For a while now, articles on the threat of artificial intelligence to certain professions have been circulating. While it is true that AI is changing the way we work, Salam Hamieh believes that the issue is not about machines replacing humans, but rather about humans and machines working together to achieve better results.
CEA-Leti is developing an innovative blood analysis technology that does not require a mass spectrometer, reagents or a qualified technician. This solution could be integrated into a portable device, which would facilitate use in areas with few healthcare facilities.
Results Reported in Nature Article Suggest Vertical GeSn Transistors May Someday Enable Low-Power, High-Performance Chips and Quantum Computers
Seven Papers Highlight Results with High-Level Integration of Technologies & Components for HPC/Edge-AI Chiplets, Optical Computing, Displays and Imagers
The field of satellite technology is undergoing a revolution with the development of “New Space” and miniaturized antennas. As space becomes increasingly crowded and raises the need for optimized power directions, the ability to reduce the size and weight of satellite antennas while maintaining their performance is essential. Marwan Jadid delivered encouraging results during his presentation, showing how these advancements are expanding possibilities for applications and services that were once thought impossible.
Thanks to its dedication to research, innovation and the transfer of technology, CEA continues to be a leader amongst French, European and international research organizations. For the 11th year in a row, CEA ranks in the Top 100 Global Innovators by Clarivate. This international ranking once again highlights the relevance and success of CEA’s strategy for intellectual property.
The CEA-Leti transfer of technology to LYNRED provides a set of technological building blocks for cooled infrared detectors with record-breaking performance
COREnext will offer efficient, scalable and virtualizable accelerators based on RISC-V extensions and FPGAs, and thus answer the need for drastically enhancing the European capabilities and foundation regarding hardware, computing, and signal processing technologies for B5G and 6G infrastructures, in the context of disaggregated, virtualized networks
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CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.