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Liste de actualités du Leti
Papers at IEDM 2020 Explore Ways to Leverage 3D Technology's Strengths For Lowering Device Energy Consumption and Energy Lost in Data Transmission. CEA-Leti presented two papers this week at IEDM 2020 that confirm the advantages of combining 3D architectures and resistive-random-access-memories (RRAM) for in-memory computing (IMC), and their applications for Edge-AI and neural networks. The projects were designed to look at different ways to leverage 3D's strengths in lowering device energy consumption as well as energy lost during data transfer.
Founded in 1992 by four CEA researchers who wanted to exploit Smart Cut™ technology to produce silicon on insulator (SOI) wafers on an industrial scale, Soitec is one of the first startups to arise from CEA-Leti.
Aledia, a French startup pioneering a disruptive technology for microLED displays, today announced it has manufactured the world's first microLED chips produced on 300mm (12") silicon wafers. The company, which developed its breakthrough technology on 200mm (8") silicon wafers over the past eight years, will produce the chips on both 200mm and 300mm wafers.
Gallium Nitride Seen as Highly Efficient Replacement for Silicon in Wide Range of Consumer and Industrial Uses. Two complementary research papers from CEA-Leti confirmed that the institute's approach to gallium-nitride (GaN) technologies is on track overcome challenges in the architecture and performance of advanced GaN devices embedding a MOS gate, and targeting the fast-growing global market for power-conversion systems.
Invited paper at IEDM 2020 shows benefit of CEA-List’s architectures in co-optimizing CEA-Leti’s 3D toolbox to enable higher bandwidth & heterogeneity for high-performance processors.
CEA-Leti’s Startup Avalun released its Covid-19 antigen test a few days ago. This powerful growth driver will also help speed up the rollout of Avalun’s portable lab, LabPad® Evolution.
CEA-Leti has added even more new 300 mm equipment this year. The institute's clean rooms can now fabricate their own low-resistance ohmic contacts—a BEOL process where the electrical junctions that link the active components of a circuit to the circuit's connectors are made. This new capability will give even more weight to the R&D services CEA-Leti offers semiconductor-industry partners.
Optically pumped germanium-tin micro-disks encapsulated by silicon nitride and transferred onto aluminum pillars generate a 2.5-micron laser beam with an ultra-low threshold. Laser beams with no III-V materials are no longer a dream… See results published in Nature Photonics.
The miniature, hyper-sensitive photoacoustic sensors being developed by the Redfinch consortium, which includes CEA-Leti, a CEA Tech institute, can detect even the tiniest gas leaks in real time, making them ideal for petrochemical plant monitoring.
CEA-Leti and Davey Bickford Enaex, a worldwide leader in blasting solutions, have extended their joint laboratory for three years to continue development of innovative radio-frequency communication systems that remotely control networks of high-tech wireless electronic detonators.
CEA-Leti will unveil its latest scientific results in 3D sequential integration for neural networks, 3D RRAM for in-memory computing and GaN-on-Si for power electronics at IEDM 2020, Dec. 12-16. The event will be held virtually because of the coronavirus pandemic.Institute scientists are lead authors on four papers and contributing authors on five more that will be presented during the conference.
By melting a thin layer of material onto an object, CEA-Leti researchers can produce a micrometric pattern, resulting in a unique non-reproducible artificial fingerprint. This holds excellent potential for creating anti-counterfeiting labels on processors, jewelry, watches, and other valuables.
Clinatec has been trying to effectively determine the best location in the brain for its WIMAGINE® implant, which measures the brain activity of tetraplegic patients.
Project Will Build Demonstrators for Transmitting and Receiving Qubits and Focus on Integrating the Technology in a Unique Platform to Address Quantum Computing Applications
What’s new: CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design. The research will focus on assembly of smaller chiplets.,, optimizing interconnection technologies between the different elements of microprocessors, and on new bonding and stacking technologies for3D ICs, especially for making high performance computing (HPC) applications.
Mag4Health, a future startup and CEA-Leti spinoff, won an award at the i-Lab 2020 competition. The project aims to develop a helmet-sized magnetoencephalography (MEG) system that represents a major advance with regard to today’s bulky machines.
The 300 mm pilot line at CEA-Leti, a CEA Tech institute, recently acquired advanced wafer defect inspection and review equipment to meet the needs of its industrial R&D partners.
With Ultimate Goal of Improving Virus Knowledge, Team Now Will Use its Optomechanical System to Design a Prototype for Airborne Virus Analysis. Targeting analysis of biological particles with large aspect ratios, such as viruses or fibrils, CEA scientists have demonstrated a breakthrough in single-particle mass spectrometry (MS) that could fast track the detection of viral particles in hospitals, offices, airplanes and other public places.
Researchers from CEA-Leti, a CEA Tech institute, tested a novel hypothermia treatment for glioblastoma, a particularly serious type of brain tumor, at biomedical research center Clinatec.
SureWash device is the very first system capable of measuring quality of hand washing in real time. It also provides special training to improve hygiene practices.
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CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.