innovation for industry
SAN FRANCISCO – Dec. 2, 2018 – Leti, a research institute of CEA-Tech, and Silvaco Inc., a leading global provider of software, IP and services for designing chips and electronic systems for semiconductor companies, today announced during the IEDM 2018 conference a project to create innovative and unified SPICE compact models for the design of advanced circuits using nanowire and nanosheet technologies.
“Over two decades, CEA-Leti and Silvaco have collaborated on design-technology co-optimization, ranging from innovative TCAD simulation to the design of advanced nanoelectronics, and thus expanded and strengthened Silvaco’s suite of tools for designers,” said Emmanuel Sabonnadière, CEA-Leti CEO. “This project continues that partnership, and when these physics-based compact models are made available to designers worldwide, they will be able to evaluate the potential of advanced nanowire-based CMOS technologies under development at CEA-Leti.”
“DTCO, including circuit simulation, is fundamental to the development of electronic devices, and shrinking silicon geometries are placing an even greater premium on accuracy to capture and evaluate all the new physical effects in nanometer design,” said Eric Guichard, vice president of Silvaco's TCAD Division. “Building on past successes of Leti and Silvaco’s collaboration, this project will provide circuit designers and technologists with powerful, advanced design flows that combine CEA-Leti’s physical, predictive, and easy-to-use models with Silvaco’s high-accuracy EDA tools.”
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.