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Platform Optimizes Control and Readout of Qubits by Placing Control Electronics Near Quantum Chips Without Wire Bonding
Realization of a QuIC3 demonstrator for 3D co-integration of quantum chips with CryoCMOS FDSOI 28nm control chips is an important step toward a full quantum computing system that operates at a very low temperature, less than 1 K, with optimum control and reading performance, said Maud Vinet, head of CEA-Leti's quantum computing program.
This interposer breakthrough is a unique combination of expertise on quantum physics, 3D technologies, material integration, IC interface, passives design and micro-architecture to achieve a solution adapted to quantum computation, Vinet said. The platform optimizes the control and readout of qubits by bringing the control electronics to the vicinity of the quantum chip without wire bonding.
All of these elements aim to reach very large-scale integration of qubits," Vinet added. Next generations of the interposer will incorporate through silicon vias (TSV) to increase the connection density and eliminate wire bonding.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.