Department of Electrical Engineering and Computer Science, Vanderbilt University, Nashville, TN, United States, Department of Physics, Vanderbilt University, Nashville, TN, United States, Department of Physics, University of California at Berkeley, Berkeley, CA, United States, Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA, United States, Department of Electrical and Computer Engineering, University of Minnesota, Minneapolis, MN, United States, Department of Electrical and Computer Engineering, University of Louisville, Louisville, KY, United States, Department of Electrical and Computer Engineering, Case Western Reserve University (CWRU), Cleveland, OH, United States, CEA-Leti, MINATEC Campus, 17 rue des Martyrs, Grenoble Cedex 9, France, Sandia National Laboratories, Albuquerque, NM, United States, Army Research Laboratory, Adelphi, MD, United States, Department of Materials Science and Engineering, North Carolina State University, Raleigh, NC, United States, Electronics Science and Technology Division, Naval Research Laboratory, Washington, DC, United States, G W Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, United States, School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA, United States

The potential of micro and nano electromechanical systems (M and NEMS) has expanded due to advances in materials and fabrication processes. A wide variety of materials are now being pursued and deployed for M and NEMS including silicon carbide (SiC), III-V materials, thin-film piezoelectric and ferroelectric, electro-optical and 2D atomic crystals such as graphene, hexagonal boron nitride (h-BN), and molybdenum disulfide (MoS2). The miniaturization, functionality and low-power operation offered by these types of devices are attractive for many application areas including physical sciences, medical, space and military uses, where exposure to radiation is a reliability consideration. Understanding the impact of radiation on these materials and devices is necessary for applications in radiation environments. © 2016 IOP Publishing Ltd.

2D materials, MEMS, micromachined cantilevers, NEMS, radiation effects, silicon carbide (SiC)

Boron carbide, Boron nitride, Ferroelectric materials, MEMS, NEMS, Silicon carbide, Hexagonal boron nitride (h-BN), Low-power operation, Micromachined cantilever, Molybdenum disulfide, Nano electromechanical systems, Radiation environments, Silicon carbides (SiC), Thin film piezoelectric, Radiation effects