Univ. Grenoble Alpes, Grenoble, France, CEA, LETI, MINATEC Campus, Grenoble, France, CEA, LITEN, Grenoble, France, CEA, Saclay, Gif sur Yvette, France

In this paper we present a new approach for building specific packaging that is scalable, versatile and could be potentially cost competitive. Using polymer additive manufacturing, more commonly known as 3D printing, we set out to build customized structures and packages perfectly adapted to component dimensions and specifications. Two different 3D printing technologies, respectively called stereolithography and Fused Deposition Molding, were studied. The work described in this paper opens plenty of new approaches: device design with a customizable backend packaging process, packaging adapted to each different component, even on the same device, fast device prototyping with accurate characteristics, among others. Our main observation is that the stereolithography technology is compatible with microelectronics substrates. Another technology, fused deposition molding, was also tested, but was not well adapted to packaging components, the major incompatibilities being the inability to print on silicon and some coarser dimensions than those required for microelectronic applications. We argue that specific patterns for the printed structure and compatibility between substrate and printed material (which can be improved with surface modifications) are key requirements to obtain the expected results. © 2017 IEEE.

3D printing, Additive manufacturing, Electronic component, MEMS, Packaging, Polymers

Chip scale packages, Deposition, Electron devices, Manufacture, MEMS, Microelectronics, Molding, Network components, Packaging, Polymers, Printing, Substrates, 3-D printing, Component dimensions, Electronic component, Electronic device, Microelectronic applications, Packaging components, Packaging process, Printed structures, 3D printers