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CEA-Leti offers a full set of processes enabling high performance packaging of Photonic Integrated Circuits (PIC). This offer includes:
The above techniques help package pre-industrial PICs and have them qualified in system environments. The packaged modules are then tested up to 64 Gbps with state-of-the-art testing & measurement tools.
CEA-Leti offers a unique integration chain from die to system, including testing and packaging. Our packaging offer leverages all the up-to-date wafer level or die level assembling and all back-end technologies developed at CEA-Leti for years: bumps, copper pillar, micro-tubes, direct die bonding or wafer bonding.
For next generation devices (on-board transceivers, photonic interposers), CEA-Leti is currently developing new building blocks:
CEA-Leti packaging technologies have been applied to fiber optic modules targeting the following applications:
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.