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Testing Silicon Pic
CEA-Leti offers on-wafer photonic integrated circuit (PIC) testing services, including optical, electrical and/or electro-optical tests. Thousands of dies can be measured in one day, depending on circuit complexity and characteristics.
To reach this number, CEA-Leti leverages five automatic probers compatible with 300 mm wafers, and one prober compatible with 200 mm wafers. Only wafer loading is manual. Wafer alignment and measurement are fully automatic.
The optical signal—1.3 μm and 1.55 μm telecom wavelengths—is injected through optical fibers and integrated grating couplers with a very precise positioning between each other. An electrical signal is injected through current probes, and a very high frequency signal is injected into co-designed probes and devices to be tested -device design taking into account probe design and vice versa.
Fully packaged PICs can also be tested on dedicated testing benches. Analog testing can be DC, low/high frequency, and RF up to 67 GHz. Numeric testing can be performed up to 64 Gbs in NRZ and 128 Gbauds in PAM4 modulation technology.
CEA-Leti’s highly versatile facilities and team of experts help industrials save both time and money, and enjoy access to complex statistics—on or between wafers. The institute’s differentiators include:
This large testing capability addresses a growing demand for PICs, including for datacom and telecom applications. On-die testing with automatic probers can be used for a variety of PICs:
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.