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innovation for industry
From 1/27/2024 to 2/1/2024 San Francisco, California, United States
CEA-Leti's optics and photonics multidisciplinary teams will present their latest solutions for all-wavelength imaging (visible, infrared, THz), information display systems, light-emissive components, optical data communications, optical sensors, and much more at Photonics West 2024, Jan. 27-Feb. 1 in San Francisco.
These innovative solutions address many commercial needs and we look forward to discussing potential R&D collaborations and technology transfers to our industrial partners," said Laurent Fulbert, deputy head of CEA-Leti's Optics and Photonics Division.
Presentation: Silicon nitride photonics: large scale integration and applications (Invited Paper)
conference: Integrated Optics: Devices, Materials, and Technologies XXVIII
Feb 1st - 8:30 AM to 9:00 AM
Don't miss CEA-Leti's stand & workshop during Photonics West 2024 to discover our latest R&D available in photonic technologies
Booth #5129A/North Hall French Pavilion
The Moscone Center
San Francisco
W San Francisco, Great Room
181 3rd Street, San Francisco
(located just steps from Moscone Center)
Programm & Register
Website
Location:
The Moscone Center
San Francisco, California, United States
Booth: French Pavilion
Contact: aurelie.tapini@cea.fr
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Event | San Jose, California
Event | Agenda | Plug and Play Tech Center. 440 North Wolfe Road Sunnyvale, CA 94085 United States
See some of the latest semiconductor technologies in action and network with industry professionals at this Bay Area event. You’ll come away with new ideas about how to put the latest technological advances to work for your innovative products and solutions!
Denver, Colorado, USA
RENOBLE, France – April 23, 2024 – CEA-Leti will present seven papers and one poster on its latest developments in microelectronics packaging, including three covering 3-layer integration, at the Electronic Components and Technology Conference (ECTC), May 28-31, in Denver. A pioneer in FD-SOI technology, the institute is at the forefront of heterogeneous 3D integration and enables the combination of More Moore and More than Moore technologies. 3D integration and advanced packaging technologies are becoming mainstream for modular, high-bandwidth, low power consumption and efficient system architectures from consumer and automotive applications to high performance computing (HPC) and edge AI multi-layer smart imagers developed in the frame of IRT Nanoelec. From high-density interconnection (fine pitch hybrid bonding DtoW and WtoW) to ultra-thin stacking layer interconnection with high density TSV and low temperature process, CEA-Leti is pushing the limits of 3D integration. It also is preparing the next generation of quantum computing with a complete set of packaging technologies.
Event | Maison Minatec, Grenoble, France
The world needs lower-power, more resource-efficient electronics for a array of use cases, and the semiconductor industry is understandably excited about the recent surge in investments. This is good news for the industry—and it will create unprecedented opportunities.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.