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CEA-Leti @SPIE Advanced Lithography + Patterning

From 2/26/2023 to 3/2/2023
San Jose, California, United States

This year, CEA-Leti researchers will present 11 papers at SPIE Advanced Lithography + Patterning 2023, the world's premiere lithography event where leaders come to solve challenges in lithography, patterning technologies, and materials for the semiconductor industry.

Attenders will have the occasion to discuss with CEA-Leti's teams latest advances in:

  • Immesion Lithography
  • Advanced metrology & computational metrology
  • 3D patterning, nanoimprint & grayscale
  • Bio inspired patterning


​Time & Place



February 28

Time: 4:30 PM - 4:50 PM PST
​Room: Grand Ballroom 220B
​Can remote SEM contours be used to match various SEM tools in fabs?
​J. Pradelles, L.Perraud, E. Sezestre, Aulrélien Fay, N. G. Schuch, T. Figueiro,F.  Robert
Time: 4:50 PM - 5:10 PM PST
​Room: 211B
​Replication of 3D patterns from a grayscale resin master by nanoimprint process
​A. Warsono, D. S. F. Rodas, J. Rêche, A. De Lehelle D'Affroux, S. Bérard-Bergery

​March 1

​Time: 4:00 PM - 4:20 PM PST​
Room: 220C
Chitosan as a water-based photoresist for DUV lithography
​I. Servin, A. Teolis, A. F. Bazin, A. Sarrazin, P. Durin, O. Sysova, B. Saudet, D. Léonard, O. Soppera, J.-L. Leclercq, Y. Chevolot, R. Tiron, T. Delair, S. Trombotto
​Time: 5:30 PM - 7:00 PM PST
Room: Hall 2
​Hierarchical patterning: sub-10 μm 3D structures nano-textured by block copolymer self-assembly
​R. Feougier, M. Argoud, N. Posseme, R. Tiron
​​Time: 5:30 PM - 7:00 PM PST
Room: Hall 2
​Overlay performances of wafer scale nanoimprint lithography
​J. Rêche, A. Warsono, A. De Lehelle D'Affroux, J. Khan, S. Haumann, A. Kneidinger

​​Time: 5:30 PM - 7:00 PM PST
Room: Hall 2
​E-beam direct write lithography the versatile ally of optical lithography
​F. Laulagnet, J.-A. Dallery, L. Pain, M. May, B. Hemard, F. Garlet, I. Servin, C. Sabbione
​​Time: 5:30 PM - 7:00 PM PST
Room: Hall 2

​Fine improvement of track process defectivity rate targeting minority yield-killing defect classes using a novel defect detection procedure combining high sensitivity optical inspection, guided e-beam inspection and AI technology​J. P. Nacenta Mendivil, M. Harumoto, M. May, R. Tiron, K. Jullian, Y. Tanaka, A. Royer, F. Kouemeni Tchouake, L. Couturier

​​Time: 5:30 PM - 7:00 PM PST
Room: Hall 2
​Die-level nano-topography metrology to characterize the stress-induced in-plane distortion contribution to

​V. Balan, F. Michel, I. Mendes, C. Lapeyre, L. Vignoud, R. Otten, O.
Mouraille, L. van Dijk, B. Minghetti, J. Depre, R. J. F. van Haren

​March 2

​​​Time: 8:50 AM - 9:10 AM PST
Room: 220B

​Critical dimension measurement techniques from synchrotron small angle X-ray scattering to industrial optical scatterometry techniques
T. Choisnet,  A. Hammouti, V. Gagneur, J. Reche, G. Rademaker, G. Freychet, G. Jullien, J. Ducote, P. Gergaud, D. Le Cunff
​​​Time: 9:10 AM - 9:30 AM PST
Room: 220B

​Critical dimension grazing incidence small angle x-ray scattering using a compact Cu-Kα x-ray source
​G. Freychet, Y. Blancquaert, G. J. Rademaker, P. Gergaud
​Time: 5:30 PM - 7:00 PM PST
Room: 211B
​Impact of optical mask variability on 3D grayscale lithography patterning
​S. Bérard-Bergery, G. Bélot, U. Palanchoke, A. Fay, E. Sungauer, C. Beylier, F. Tomaso, R. Coquand

Practical information

Dates: 26 February - 2 March 2023

Location: San Jose, California, United States​

Website:  click here

Technical program: click here

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