innovation for industry
Event | Agenda
From 9/6/2023 to 9/7/2023
Noviotech Campus, Netherlands
Come and discuss with Jean Charles-Souriau the CEA-Leti expert on semiconductor packaging
CEA-Leti is member of the SEMI integrated Packaging, Assembly, and Testing (SiPAT) Technology Community's which goal is to promote the sustainable development of the Semiconductor Packaging, Assembly, and Test industry in Europe.
CEA-LETI is focusing on achieving high levels of heterogeneous integration of technologies and components on a host silicon wafer through high-density interconnections (fine pitch) to meet requirements of HPC/edge-AI chiplets, optical computing, displays and imagers. It offers a wide range of advanced, complementary technologies such as Wafer Level Heterogeneous Integration, 3D Packaging, Chiplets interconnect on Si interposer, Hybrid Bonding, FanOut WLP and Flexible Packaging.
Web site : https://europat.org/
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The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of leading-edge research and development results in the field of process and device simulation. SISPAD is one of the longest-running conferences devoted to technology computer-aided design (TCAD) and advanced modeling of novel semiconductor devices and nano-electronic structures.
Centre des Congrès, Lyon
Are you looking for an R&D partner to bring your project to life or accelerate its market launch?
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.