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AWARD - Outstanding Interactive Presentation Paper - Aurélia Plihon

​​​​​​​​​​​​​​​​​​​​​​​​​​​Advanced 3D packaging is a complex technology that is expected to become increasingly important in packaging a wide range of electronic devices in various fields such as IoT, AI, or medical fields. Finding viable solutions to meet the growing global demand for new integration developments has therefore become relevant. 

Published on 25 July 2023

Congratulations to Aurélia Plihon for her "Outstanding Interactive Presentation Paper" award at ECTC 2022!

After completing an #engineering school in materials and a 5-year experience abroad, Aurélia joined CEA-Leti intending to work on integrating innovative 3D packaging processes, in particular Fan Out Wafer-Level Packaging (FOWLP). FOWLP involves rebuilding wafers from different chips that can be placed one on top of the other, all molded from a silica-filled epoxy (EMC: Epoxy Molding Compound). Vertical interconnections, called TMI (Through Molding Interconnection), were developed to link the chips together. She was awarded for developing a simple integration of these TMIs.

  • ​​Aurelia and her team achieved impressive results and reached TMIs with an unprecedented height-to-pitch ratio, with a 225 μm height, a 50 µm diameter, and a pitch of only 100 μm.​

With these results, Aurélia offers a simple solution for achieving state-of-the-art high aspect ratio vertical interconnects. It will make it possible to develop more complex integrations with a high density in FOWLP applications.

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