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As the limits of Moore’s Law approach, advanced chip packaging has emerged as a solution for continued scaling. CEA offers a complete chiplet and 3D integration toolkit enabling a modular “one to many” approach that speeds up the development of new solutions for automotive, high-performance computing,data centers, imaging, and more.
ManuFacturers in a wide range of industries can speed up the development of new products with a “one to many” approach that re-uses Lego-like modules. CEA possesses all the technologies needed to break up monolithic circuits into smaller, modular units called chiplets and reassemble, or “package” them into high-performance, low power 3D integrated circuits for specific use cases and families of chips that offer different levels of performance at different price points, from entry-level to high-end.
The multi-partner EPI is developing a European processor for tomorrow’s high-performance and Edge computing systems. CEA is working on advanced technologies to interconnect the chiplets in this future processor.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.