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Article | High performance computing
Taking up tomorrow's computing challenges in a connected world: maintaining performance progress while curtailing power consumption.
New computing technologies
A solution to the problem of excessive variability in ReRAM (resistive memory) could be found in Mott insulators, metals that conduct electricity in theory, but that turn out to be insulators.
CEA-Leti invites decision makers on the lookout for innovative and promising chip-based R&D, as well as editors, analysts and entrepreneurs to peruse the institute's reader-friendly "2021 Highlights" report
Primo1D miniaturizes RFID devices to integrate them into a textile thread, a true alternative to the detachable and cumbersome RFID tag.
CEA, in collaboration with CNRS Néel, a leading team in SI-based quantum computing, presented two papers on that topic at IEDM 2021, including an invited paper that identifies the material and integration challenges facing large-scale Si quantum computing. The second paper presents a novel Si quantum device integration that reduces by half the effective gate pitch and provides full controllability in 1D FDSOI quantum dot (QD) arrays.
CEA-Leti has reported the world’s-first demonstration of 16-kbit ferroelectric random-access memory (FeRAM) arrays at the 130nm node that advances this energy-saving technology closer to commercialization. The breakthrough includes back-end-of-line (BEOL) integration of TiN/HfO2:Si/TiN ferroelectric capacitors as small as 0.16 µm², and solder reflow compatibility for the first time for this type of memory.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.