innovation for industry
Article | High performance computing
Taking up tomorrow's computing challenges in a connected world: maintaining performance progress while curtailing power consumption.
New computing technologies
Kalray, which completed its IPO last year, recently signed a distribution contract that will bring its intensive computing solutions for artificial intelligence to the rapidly-growing Chinese market
The demo enables massively parallel, low-power and low-latency computation abd will be demonstrated at Flash Memory Summit 2019, August 6-8.
CEA-Leti and Stanford University have developed the world’s first circuit integrating multiple-bit non-volatile memory (NVM) technology called Resistive RAM (RRAM) with silicon computing units, as well as new memory resiliency features that provide 2.3-times the capacity of existing RRAM. Target applications include energy-efficient, smart-sensor nodes to support artificial intelligence on the Internet of Things, or “edge AI”.
CEA-Leti today announced during IEDM an extension of its 300mm silicon-based wafer line to open new R&D avenues for its industrial partners.
During the state visit of His Excellency Emmanuel Macron President of the French Republic, the Belgian research center imec and the French research institute CEA-Leti, two world-leading research and innovation hubs in nanotechnologies for industry, announced that they have signed a memorandum of understanding (MoU) that lays the foundation of a strategic partnership in the domains of Artificial Intelligence and quantum computing, two key strategic value chains for European industry, to strengthen European strategic and economic sovereignty.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.