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Article | High performance computing
Taking up tomorrow's computing challenges in a connected world: maintaining performance progress while curtailing power consumption.
New computing technologies
Rapid advances in resistive oxide memory (OxRAM) could soon put the technology on manufacturers' production lines.
Targeted Applications Include High-Dimensional Distributed Environmental Monitoring, Implantable Medical-Diagnostic Microchips, Wearable Electronics & Human/Computer Interfaces
Papers at IEDM 2020 Explore Ways to Leverage 3D Technology's Strengths For Lowering Device Energy Consumption and Energy Lost in Data Transmission. CEA-Leti presented two papers this week at IEDM 2020 that confirm the advantages of combining 3D architectures and resistive-random-access-memories (RRAM) for in-memory computing (IMC), and their applications for Edge-AI and neural networks. The projects were designed to look at different ways to leverage 3D's strengths in lowering device energy consumption as well as energy lost during data transfer.
Invited paper at IEDM 2020 shows benefit of CEA-List’s architectures in co-optimizing CEA-Leti’s 3D toolbox to enable higher bandwidth & heterogeneity for high-performance processors.
CEA-Leti will unveil its latest scientific results in 3D sequential integration for neural networks, 3D RRAM for in-memory computing and GaN-on-Si for power electronics at IEDM 2020, Dec. 12-16. The event will be held virtually because of the coronavirus pandemic.Institute scientists are lead authors on four papers and contributing authors on five more that will be presented during the conference.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.