Starting date : Apr. 2015 > Mar. 2018 Lifetime: 36 months
Program in support : CATRENE, call 7 (2014)
Status project : complete
CEA-Leti's contact :
Pierre Montmeat
Project Coordinator: RECIF (FR)
Partners: - Evg, (AU)
- Imec, (BE)
- Entegris, (DE)
- CEA-Leti, (FR)
- Fogale, (FR)
- Recif, (FR)
- ST Microelectronics, (FR)
- Nanium, (PO)
Publications«Mechanical behaviour and delamination mechanisms in temporary bonding», K. Vial et al, conference ESTC 2016,Grenoble, France.
«Debonding capacity of mechanical debonding equipment depending on the bonding strength of directly and polymer bonded wafer pairs», K. Vial et al, conference Wafer Bond 2015, Braunschweig, Germany. «Polymer bonding temperature impact on the morphology and on the adherence energy of the bonded stack», P. Montméat et al, conference Wafer Bond 2015, Braunschweig, Germany.
«Development and adhesion characterization of a silicon wafer for temporary bonding», P. Montméat et al, International Journal of Adhesion and Adhesives 82 (2018) 100–107.
Target market: n/a
Investment: € 1.8 m.
EC Contribution: € 0.7 m.
| Stakes
- CEA-Leti activity:
The main task of the year was to modify the current 300 mm EVG560 bonder used at CEA-Leti. Performed at EVG headquarters, this involved adding a coating capability to the existing tool. EVG delivered the coater tool to CEA-Leti in August 2016. The bonding and coating capabilities of the new tool were validated with a polymer adhesive. The quality of the bonding process were excellent and the resulting bonded stack exhibited no defect (void or de-lamination). This created a robust process suitable for production. The operational coating produced an adhesive film with no air bubbles or de-wetting areas and the bonding process obtained from this structure was defect-free.
A project sub-task was to select an efficient temporary adhesive for use in the new EVG560 tool. For this, a vehicle test was defined and CEA-Leti identified a polymer adhesive compatible with high temperature processes. We demonstrated that a bonded structure using the new adhesive did not exhibit de-lamination below 350°C, whereas a standard adhesive de-laminated from 250°C. This compound is thus very promising in particular for high temperature oxide deposition.
A study of the de-bonding process was started and CEA-Leti demonstrated the possibility of on-frame de-bonding of the new adhesive, leading to a dismounted wafer with no cracking or chipping.
CEA-Leti is now in a position to supply various 300 mm 3D wafers to RECIF and FOGALE for designing and testing a the new inspection tool.
Through Silicon Via (TSV) is a “More-than-Moore” technology that allows development of new chip architectures. A number of challenges remain in the several process steps for making TSV products cost efficient. The project aimed to provide HVM ramp-up support and improvement in TSV product manufacturing yield.
Challenges addressed in the project: • Handling of 300 mm heterogeneous wafers with edge trim inspection • Development of metrology and new logistical concepts for wafers on 380mm frames • Improvement of temporary bonding and debonding processes.
Synergies were created with other CATRENE projects such as NGC450, SOI450 and MASTER_3D.
The project plan was broken down into four work packages extending over 3 years.
The industrial partners released new products to the market in 2018.
IMPACT
The TSV HANDY project prompted strong collaboration between CEA-Leti and EVG. It entailed setting up a new coating capability on existing equipment in the CEA-Leti clean room.
The project also promoted CEA-Leti as a European leader in the field of 3D integration: we supplied various 3D wafers for upgrading the inspection tool at RECIF and FOGALE.
The TSV HANDY project has led to delivery of an automatic platform for inspecting and handling 3D wafers. To our knowledge, it is the first time that such a tool has been developed and installed in AMKOR in an industrial environment.
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