EVENT
Discover CEA-Leti’s latest results in Next-Generation Chip Integration at ECTC 2026
CEA-Leti experts will be onsite at booth 502 and available to discuss the findings of Seven Papers and Posters Includes Hybrid Bonding and Low-Temperature Processing
COME AND MEET CEA-LETI'S EXPERTS
This year, CEA-Leti’s booth will exhibit STARAC, Hybrid bonding, Chip-in-Flex, FOWLP. Come and discuss lastest achievements in terms of Next-Generation Chip Integration at ECTC 2026
Booth N° 502
FOWLP
Advanced packaging technology for heterogeneous System-in-Package (SiP)
Quantum packaging
A multi-chip assembly with quantum processor and control chips
STARAC
Chiplet-based Optical Network on Chip (ONoC)

Hybrid bonding
An enabling technology for new architectures
DISCOVER
CEA-LETI’S MAJOR SCIENTIFIC RESULTS
CEA-Leti will present seven papers and posters on technologies shaping the next decade of advanced heterogenous integration at the Electronic Components and Technology Conference (ECTC) May 26-29 in Orlando, Fla.
These developments cover a variety of technologies, including reducing interconnect pitches through hybrid bonding interconnection, the requirement for low-temperature processes, superconducting interconnects and fan-out wafer-level packaging.
CEA-Leti scientific papers
May 27, 2026 9:30 AM
Session 3 - Tuscany D
Margot Faure
Hybrid Bonding with Ultra-Low Temperature Annealing: Morphological and Electrical Validations
May 27, 2026 11:35 AM
Session 3 - Tuscany D
Mathieu Loyer
(in collaboration with STMicroelectronics)
Enabling Low-Temperature Fine-Pitch Hybrid Bonding: Role of Nanocrystalline Copper Microstructures and Pre-Bond Surface Treatments
May 27, 2026 2:30 PM
Session 40 (Poster) -Mediterranean Hallway
Arnaud Garnier
RADAR System-in-Package with Integrated Antennas based on Fan-Out Wafer-Level Packaging RDL-First Integration
May 27, 2026 4:45 PM
Session 21 - Tuscany D
Maria-Luisa Calvo-Munoz
Electroplated Indium Micro-Bumps: Toward Scalable Low Temperature Ultra-Fine Pitch Interconnects
May 28, 2026 10:00 AM
Session 39 (Poster) -Mediterranean Hallway
Agathe Lerat
Impact of Copper Density on >Via-to-Via Hybrid Bonding: Morphological and Electrical Characterizations
May 28, 2026 10:00 AM
Session 39 (Poster) -Mediterranean Hallway
Pablo Renaud
Fine-Pitch Thermally Resistive Superconducting 3D Interconnects for Quantum Systems
May 29, 2026 2:00 PM
Session 31 - Palazzo D
Melissa Najem
Die-To-Wafer Hybrid Bonding Technology Down to 1 µm Pitch for Multi-Die Stacking Integration
ABOUT
ECTC
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.
More information on ECTC’s website