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ECTC 2026

From 5/26/2026 to 5/29/2026
Orlando,USA

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Discover CEA-Leti’s latest results in Next-Generation Chip Integration at ECTC 2026

CEA-Leti experts will be onsite at booth 502 and available to discuss the findings of Seven Papers and Posters Includes Hybrid Bonding and Low-Temperature Processing

COME AND MEET CEA-LETI'S EXPERTS

This year, CEA-Leti’s booth will exhibit STARAC, Hybrid bonding, Chip-in-Flex, FOWLP. Come and discuss lastest achievements in terms of Next-Generati​on Chip Integration at ECTC 2026

Booth N° 502

FOWLP 

Advanced packaging technology for heterogeneous System-in-Package (SiP)

 

Quantum packaging​

A multi-chip assembly with quantum processor and control chips

 

STARAC

Chiplet-based Optical Network on Chip (ONoC)​​​

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Hybrid bonding

An enabling technology for new architectures​

 


 

DISCOVER CEA-LETI’S MAJOR SCIENTIFIC RESULTS

CEA-Leti will pre​sent seven papers and posters on technologies shaping the next decade of advanced heterogenous integration at the Electronic Components and Technology Conference (ECTC) May 26-29 in Orlando, Fla. 

These developments cover a variety of technologies, including reducing interconnect pitches through hybrid bonding interconnection, the requirement for low-temperature processes, superconducting interconnects and fan-out wafer-level packaging.​


CEA-Leti scientific papers​​

May 27, 2026 9:30 AM
Session 3Tuscany D

Margot Faure 

Hybrid Bonding with Ultra-Low Temperature Annea​ling: Morphological and Electrical Validations

May 27, 2026 11:35 AM 
Session 3Tuscany D

Mathieu Loyer
(in collaboration with STMicroelectronics)

Enabling Low-Temperature Fine-Pitch Hybrid Bonding: R​ole of Nanocrystalline Copper Microstructures and Pre-Bond Surface Treatments

May 27, 2026 2:30 PM 
Session 40 (Poster) -​Mediterranean Hallway

Arnaud Garnier

RADAR System-in-Package with Integrated Antennas based on Fan-Out Wafer-Level Packaging RDL-First Integration

May 27, 2026 4:45 PM 
Session 21​Tuscany D

Maria-Luisa Calvo-Munoz

Electroplated Indium Micro-Bumps: Toward Scalable Low Temperature Ultra-Fine Pitch Interconnects​

​May 28, 2026 10:00 AM
Session 39 (Poster) -Mediterranean Hallway

Agathe Lerat

Impact of Copper Density on >Via-to-Via Hybrid Bonding: Morphological and Electrical Characterizations

May 28, 2026 10:00 AM
Session 39 (Poster) -Mediterranean Hallway

Pablo Renaud

Fine-Pitch Thermally Resistive Superconducting 3D Interconnects for Quantum Systems

May 29, 2026 2:00 PM
Session 31Palazzo D

Melissa Najem

Die-To-Wafer Hybrid Bonding Technology Down to 1 µm Pitch for Multi-Die Stacking Integration


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​ABOUT ECTC

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

DL_Icon.pngMore information on ​​ECTC’s website


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Practical information

From 5/26/2026 to 5/29/​​​2026​ | Orlando,USA

W​ebsite​​​

 Contact:​ Jean-Charles SOURIAU​​  with any questions.​​


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Jean-Charles SOURIAU

Scientific leader in 3D & packaging









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