EVENT
Discover CEA-Leti’s scientific excellence at the SEMICON EUROPA
At the MEMS & Imaging Sensors Summit, CEA-Leti will showcase how its cutting-edge research in MEMS and sensor technologies is driving innovation from the lab to real-world applications.
Together with its startups, CEA-Leti will highlight breakthrough technologies addressing the new challenges of sensing and Physical AI, from advanced MEMS and optomechanics to next-generation inertial sensors and miniaturized energy solutions.
MEET OUR EXPERTS AND STARTUPS AT SEMICON EUROPA AND DISCOVER HOW CEA-LETI IS HELPING SHAPE THE FUTURE OF SENSING.
MEMS & Imaging Sensors Summit
Sensing in the Age of Physical AI - TechARENA, Hall B0
Wednesday, November 11 - 11:45 a.m.
Boosting MEMS through technological development: from improved transduction to optomechanics
Marc SANSA
Project Manager in Optomechanics, CEA-Leti
@UtopikPhoto-CEA-BD
MEMS & Imaging Sensors Summit
Sensing in the Age of Physical AI - TechARENA, Hall B0
Wednesday, November 11 - 12:25 p.m.
Ultra miniaturized rechargeable solid-state micro battery technology for new generation of implantable medical devices
Philippe ANDREUCCI
Chief Executive Officer, Injectpower
@UtopikPhoto-CEA-BD
MEMS & Imaging Sensors Summit
Sensing in the Age of Physical AI - TechARENA, Hall B0
Wednesday, November 11 - 1:45 p.m.
NEMS-Based Inertial Sensors: Enabling Navigation-Grade Performance for High-Volume Autonomous Applications
Philippe ROBERT
CEO, INGAGE
@UtopikPhoto-CEA-BD
MEMS & Imaging Sensors Summit
Sensing in the Age of Physical AI - TechARENA, Hall B0
Wednesday, November 11 - 12:45 p.m.
Closing Remarks by Session Chair
Pierre Damien BERGER
MEMS Industrial Partnerships Manager, CEA-Leti
MEMS & Imaging Sensors Summit
Sensing in the Age of Physical AI
Committee Members
Gilles SICARD
Senior Scientist, CEA-Leti
@UtopikPhoto-CEA-BD
VISIT THE FAMES PILOT LINE TEAM AT CHIPS JU'S BOOTH C2311 - HALL 2 !
Meet our experts and explore advances in: FD-SOI, Embedded Non-Volatile Memories, RF, 3D integration and Power Management ICs.
The FAMES Pilot Line of the Chips JU is funded by Horizon Europe and Digital Europe Programmes and the National Public Authorities of the partners involved.
Grants N° 101182279 and 101182297. | 
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ABOUT MEMS & IMAGING SENSORS SUMMIT
Physical AI begins with sensing. As AI moves into the physical world, application-specific sensors are becoming essential for enabling efficient, reliable, and scalable systems. This year the MEMS & Imaging Summit explores how sensor innovation, semiconductor technologies, and advanced manufacturing are shaping the next generation of Physical AI. From custom sensor design to system integration, industry experts will discuss how purpose-built sensing solutions are driving practical applications across medical, manufacturing and consumer applications.
More information on MEMS & Imaging Sensors Summit’s website