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Event | Agenda


Open Innovation Materials & Manufacturing Europe

From 2/16/2027 to 2/18/2027
Grenoble, France

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Open Innovation Materials & Manufacturing Europe 2027: registrations and call for papers are now open​

CEA-Leti is proud to co-organize the first edition of Open Innovation Materials & Manufacturing Europe (OIM² Europe), a new European forum designed to bridge the gap between cutting-edge research and industrial innovation in advanced materials, nanotechnologies, and sustainable manufacturing. 


​Visit the official event website at www.oim2.eu to submit your paper and secure your place at this inaugural edition.​​​​​


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ABOUT THE 1st  OIM2.eu FORUM

Held at the Minatec Conference Center, at the heart of one of Europe’s leading innovation hubs, the event will gather around 500 industry, academic, and policy leaders. Rather than simply showcasing scientific results, the conference is built to drive real-world impact. 

 By focusing on technology transfer and market-ready breakthroughs, OIM2.eu 2027 helps industry grasp emerging opportunities, identify solutions ready for scale-up, and forge partnerships that speed the adoption of sustainable manufacturing technologies. We would like to bring together industrial, academics and policy makers and to make a concrete technology transfer between academia and industry.​

DL_Icon.pngMore information on ​​OIM2’s website

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Practical information

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OIM2² 2027

16 - 18 February 2027

Grenoble, Minatec​


Top page

CEA-Leti contacts

Narciso Gambacorti

Program Manager, CEA-Leti

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Events

  • 14 Dec au 15 Dec EU Symposium for Sustainable Digital & Electronics Technology

    Event |  Grenoble Scientific Polygon, France

    Europe has the expertise and skills to promote a more responsible digital sector (frugality, regulation, ethics) that creates high-quality jobs. However, mastery of data is just as crucial as mastery of materials and energy when it comes to the operability and sustainability of disruptive digital components and integrated circuits. More sustainable integrated hardware and software solutions will be discussed at the END* symposium in the field of Information & Communication Technologies (ICT)

  • 8 Oct
    8h30-17h30      LID Japan 2026

    Event | Agenda |  Tokyo, Japan

    CEA-Leti has invested in multidisciplinary platforms with unique equipment and expertise. By leveraging advances in heterogeneous integration, new materials and photonics, we are driving semiconductor innovation and tackling the new challenges of disruptive AI markets and technologies. During this 19th edition of Leti Innovation Days Tokyo, CEA-Leti’s CEO will celebrate R&D partnerships with its partners in Japan and explore new possibilities to support the Japanese semiconductor industry. This year’s theme is “The AI-Chip Revolution: Scaling Innovation in Semiconductors”. High-level speakers and technical experts will present the latest advances through keynote speeches, seminars and live demos. Join us to enjoy lively networking and exchanges in a unique setting at the Residence of France in Japan.

  • 21 Sep au 24 Sep International Micro & Nano Engineering Conference (MNE 2026)

    Event | Agenda |  Interlaken, Switzerland

    CEA-Leti has the honour to be invited to organize a Tutorial on sustainability in semiconductor industry and life cycle assement by the Program Chair, Helmut Schift from PSI institute. It will the second edition after the tutorial held in Montpellier in 2024 during the celebration of 50th anniversary. This full-day tutorial objective is to train engineers and young researchers both in assessing the environmental footprint assessing (LCA) and adopting sustainable practices in semiconductor industry based on eco-responsible approach. We will illustrate this using practical case studies, ranging from resource optimisation, greenhouse gas (GHG) emissions or energy consumption reduction to the resilience of electronic components. Lecturers- experts in their field will be speaking : ; Jeff Kettle, University of Glasgow, United Kingdom;Sébastien Toussaint, UCL, Belgium; Cyrille Hibert, EPFL, Switzerland, Isabelle Servin and Yannick Rivoira, CEA-Leti, France

  • 9 Sep au 11 Sep ESTC - Electronics System-Integration Technology Conference

    Event |  Helsinki, Finland

    CEA-Leti experts will be onsite at CEA-Leti's booth and available to discuss the findings of three papers on heterogeneous integration

  • 7 Sep au 10 Sep ESSERC

    Event |  Palma de Mallorca, Spain

    The aim of ESSERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits. The level of integration for system-on-chip design is rapidly increasing. This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers and system designers is necessary.