Tuesday, December 15
9:30 am - 9:55
am
17 | FS | Semiconductors for Quantum Computing
Continental 7-9
Franck Arnaud, Bruna Cardoso,
Etienne Novak, Carlos Suarez-Segovia, Giselle Elbaz, Nicolas Daval, Maud Vinet, Tristan Meunier,
Miltiadis Alepidis, Thomas Bedecarrats, Jose Lugo-Alvarez,
Mikael Casse, Aurelie Bajolet,
Flavio Bergamaschi, Victor Sabia Pereira Carpes, Philippe Galy,
Florence Sonnerat, Magali Gregoire,
Angelo Moroni, Patrick Torresani,
17-2 | 28 "FD-SOI Based Qubit/Logic 300mm Platform for Quantum Processor Unit Chip Compatible with Volume Manufacturing" – Invited
Tuesday,
December 15
10:20
am - 10:45
am
18 | RSD | Reliability of Ferroelectric Materials and Devices
Imperial A
Philémon Kouaté Wafo,
Simon Martin, Olivier Billoint,
Sam Fiette, Abygaël Viey,
Carine Jahan, Fabien Grimaud,
Julien Patouillard, Laurent Grenouillet,
18-4 | "Insights into the Reliability of HZO Ferroelectric Capacitors Through Comprehensive DC/AC TDDB and Leakage Studies"
Tuesday,
December 15
2:55 pm - 3:20
pm
21 | ALT | BEOL, Thermal and Packaging
Grand Ballroom B
Daphnee Bosch,
William Vandendaele, Anne-Sophie Royet, Patrick Reisinger, Sebastien Kerdiles, Mathieu Opprecht, Antoine Albouy, Francois-Xavier Darras,
Veronique Benevent, Lucie Laraignou, Flavien Berthaud,
Obaid Adami, Elhadji-Alhousseyni Diallo, Leo Matokwong, Mickael Ribotta, Adeline Grenier, Clemence Hellion, Remi Gassilloud, Xavier Garros, Christoforos Theodorou,
Perrine Batude,
21-3 | "Bringing 400°C Analog Devices to the Next Level: Mastering nano second Laser Annealing for 3D Sequential CMOS SOI"
Tuesday,
December 15
2:55
pm - 3:20
pm
27 | RSD | Component-to-System Level Reliability and Thermal Management
Imperial A
Abygaël Viey, Alexis Krakovinsky,
Bruno Reig, Julien Delprato,
Marios Barlas, Alexis Divay,
David Roy, Xavier Federspiel,
Xavier Garros,
27-3 | "From Dielectric Polarization to AC-TDDB Modeling in High-Density 3D MIM Capacitors"
Wednesday, December 16
9:05 am - 9:30
am
31 | NC | Edge Intelligence and On-Chip Learning
Continental 4
Matilde Piccoli, Adrien Renaudineau, Mohammed Akib Iftakher, Kamel-Eddine Harabi,
Mario Pallo, Simone D'Agostino,
Jean-Michel Portal, Damien Querlioz, Elisa Vianello, Louis Hutin,
31-1 | "Exploiting ReRAM Write-Noise in Gradient Perturbation for Few-Update On-Chip Learning"
Wednesday, December 16
9:55
am - 10:20
am
30 | PMA | High-Performance RF FETs and Switches
Continental 1-3
Ismaël Charlet, Margot Faure,
Christophe Dubarry, Erwan Morvan,
Yveline Gobil, Tarek Daher,
Arij Barboura, Fanny Morisot,
Luca Lucci, Lucas Nyssens,
Alexis Divay, Julien Delprato,
Loïc Sanchez, Romane Blaise,
Pascal Chevalier, Victor Milon,
Daniel Gloria, Cédric Durand,
Olivier Valorge,
30-3 | "Hybrid-Bonding of GaN-on-Si MIS-HEMTs onto 300 mm BiCMOS BEOL with RF PA Device and Switch Demonstrations"
Wednesday, December 16
10:45
am - 11:10
am
31 | NC | Edge Intelligence and On-Chip Learning
Continental 4
Benjamin Walker, Mohammed Iftakher, Adrien Renaudineau,
Kamel-Eddine Harabi, Mathieu Faye, Jean-Michel Portal,
Thomas Dalgaty, Joseph Friedman,
Elisa Vianello, Damien Querlioz,
31-4 | "Experimental Metropolis-Adjusted Langevin Learning with Fully On-Chip ReRAM-to-ReRAM Sampling"
MORE INFO ABOUT Tech connect 2026
Co-organized by CEA-Leti and Soitec, the event invites you to step inside their lab-to-fab pipeline and discover the next advances in semiconductors, embedded AI, sequential 3D, FeRAM memory.
December 15, 2026 | San Francisco, CA
Semiconductors, embedded AI, sequential 3D, FeRAM memory.
In an executive-level format, you will have the opportunity to:
Connect and network with your peers, exchange directly with leading experts
and explore the latest technology and market roadmaps
.
ABOUT IEDM
IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.