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Presentations Workshop D43D 2018

Published on 22 August 2018

Thank you for attending Leti D43D workshop 

To download our presentations, please click on the tittle of each presentation:

MONDAY, JULY 2nd  2018:  D43D WORKSHOP 

Opening SessionPascal Vivet, CEA-LETI, France (pdf format)
SESSION 1        Advanced 3D Image Sensors with Smart Features
                           Chairman: Gilles Sicard, CEA-Leti, France
Direct Time-of-Flight (dTOF) imaging for depth sensing applications Augusto Ronchini Ximenes, TU Delft, Nederlands (pdf format)
3D Architecture of a Fast Digital Burst Video SensorWilfried Uhring, ICUBE Laboratory, Univ. Strasbourg, France (pdf format)
RETINE: a 3D stacked in-focal-plane vision chip for monitoring applications Laurent Millet, CEA-Leti, France (pdf format)
SESSION 2      3D Integration Challenges for Photonics communication,  
                          Chairman: Alexis Farcy, STMicroelectronics, France
System-level Optimizations for 2.5D-integrated Chips with Silicon-Photonic LinksAyse Coskun, Univ. of Boston, USA (pdf format)
Toward a Top-Down Synthesis Methodology for 3D-Stacked Wavelength-Routed Optical NoCsDavide Bertozzi, Univ. of Ferrara, Italy (pdf format) 
Laser Group Control for Efficient Thermal-Aware Calibration of Nanophotonic InterconnectsIan               O'Connor, INL, France (pdf format) 
Face-to-face integration of an electro-optical link with CMOS drivers and thermal controlYvain Thonnart, CEA-Leti, France (pdf format)

TUESDAY, JULY 3rd  2018:  D43D WORKSHOP 
SESSION 3      3D Systems for Machine Learning and Memory architecture
                          Chairman: Subhasish Mitra, Stanford Univ., USA
3D Systems for Machine LearningPaul Franzon, Univ. of North Carolina, USA (pdf format) 
NTX: A Scalable Near-Memory Architecture for Training Deep Neural Networks on Large In-Memory DatasetsLuca Benini, Univ. Bologna, Italy and ETH Zurich, Switzerland (pdf format)
Challenges of 3D DRAM MemoriesChristian Weis, Univ. of Kaiserslautern, Germany (pdf format)
SESSION 4     3D Technology: Keynote and Panel 
                        Chairman: Severine Cheramy, CEA-LETI, Grenoble, France

3D scalability from high performance to ultra low power​

​Marcel Wieland, Global Foundry, Germany (pdf format)
 3D Memory : trends and obstacles        

Anton Korzh, Micron, USA

Panel "3D Technology : which road for which disruptive architectures ?"

Panelists :
- Subhasish Mitra, Univ. Stanford, USA (pdf format)
- Paul Franzon, NCSU, USA (pdf format)
- Marcel Wieland, Global Foundry, Germany, (pdf format)
- Francois Jacquet, KALRAY, France, (pdf format)
- Denis Dutoit, CEA-LETI, France (pdf format)

SESSION 5      Monolithic 3D and advanced signalling,  
                         Chairman: Laurent Le-Pailleur, STMicroelectronics, France
3D sequential integration : review of opportunities and technology updatesPerrine Batude, CEA-Leti, France (pdf format)
3D sequential integration : overview of 65 nm on 28 nm FDSOI MPW architecture and design contributions Sébastien Thuriès, CEA-Leti, France (pdf format)
Wireline Communication in 2.5-D and 3-D ICsPrzemyslaw Mroszczyk, Univ. Manchester, UK (pdf format)
SESSION 6     3D Advanced Packaging and CAD tools
                        Chairman: Pascal Vivet, CEA-LETI, France
Solutions for high density advanced package design and verificationPascal Leclaire, Mentor Graphics, France (pdf format)
From 2.5D to 3D layout design environment: Status and future challenges for advanced 3D packagingThomas Brandtner, INFINEON, Austria (pdf format)
CAD Flow methodologies for 3D Hybrid sub-systemsLise Doyen, STMicroelectronics, France (pdf format)